{
  "docket": "double-sided-anisotropic-si-etch-technique-define-through-microchannels-thick-si",
  "confidence": 0.95,
  "published_at": "2026-06-04T04:29:19Z",
  "summary": {
    "name": "summary",
    "value": "Method of etching microelectronic mechanical system features in a silicon wafer is marketed for licensing by Stanford University (OTL). It is documented in US patent US 10,395,940. The current assignee of record is Denso Corp. Google Patents reports its legal status as \u201cActive\u201d (an automated indicator, not a legal determination). Its expected expiration is 2038-03-13. Note: the patent's assignee of record is Denso Corp, not Stanford University (OTL); confirm that Stanford University (OTL) can license it before relying on this listing.",
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      "name": "title",
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    "institution": "Stanford University (OTL)",
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    "original_assignee": "Toyota Motor Engineering and Manufacturing North America Inc"
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  "link_out": {
    "institution": "Stanford University (OTL)",
    "listing_url": "https://techfinder.stanford.edu/technology/double-sided-anisotropic-si-etch-technique-define-through-microchannels-thick-si"
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}